kernel/git/stable/linux.git/drivers/thermal/Makefile, branch linux-4.10.y

thermal: core: introduce thermal_helpers.c

2016-11-23T02:06:12+00:00

Here we have a simple code organization. This patch moves functions that do not need to handle thermal core internal data structure to thermal_helpers.c file. Cc: Zhang Rui Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin Signed-off-by: Zhang Rui

thermal: core: move thermal_zone sysfs to thermal_sysfs.c

2016-11-23T02:06:12+00:00

This is a code reorganization, simply to concentrate the code handling sysfs in a specific file: thermal_sysfs.c. Right now, moving only the sysfs entries of thermal_zone_device. Cc: Zhang Rui Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin Signed-off-by: Zhang Rui

Merge branches 'thermal-soc', 'thermal-core', 'thermal-intel' and 'thermal-tegra-hw-throttle' into next

2016-09-27T06:03:19+00:00

thermal: max77620: Add thermal driver for reporting junction temp

2016-09-27T06:02:16+00:00

Maxim Semiconductor Max77620 supports alarm interrupts when its die temperature crosses 120C and 140C. These threshold temperatures are not configurable. Add thermal driver to register PMIC die temperature as thermal zone sensor and capture the die temperature warning interrupts to notifying the client. Signed-off-by: Laxman Dewangan Signed-off-by: Zhang Rui

thermal: qoriq: Add thermal management support

2016-09-27T06:02:16+00:00

This driver add thermal management support by enabling TMU (Thermal Monitoring Unit) on QorIQ platform. It's based on thermal of framework: - Trip points defined in device tree. - Cpufreq as cooling device registered in qoriq cpufreq driver. Signed-off-by: Jia Hongtao Signed-off-by: Zhang Rui

thermal: qcom: tsens: Add a skeletal TSENS drivers

2016-09-27T06:02:16+00:00

TSENS is Qualcomms' thermal temperature sensor device. It supports reading temperatures from multiple thermal sensors present on various QCOM SoCs. Calibration data is generally read from a non-volatile memory (eeprom) device. Add a skeleton driver with all the necessary abstractions so a variety of qcom device families which support TSENS can add driver extensions. Also add the required device tree bindings which can be used to describe the TSENS device in DT. Signed-off-by: Rajendra Nayak Reviewed-by: Lina Iyer Signed-off-by: Eduardo Valentin Signed-off-by: Zhang Rui

thermal: add Intel BXT WhiskeyCove PMIC thermal driver

2016-09-05T22:55:33+00:00

This change adds support for Intel BXT Whiskey Cove PMIC thermal driver which is intended to handle the alert interrupts triggered upon thermal trip point cross and notify the thermal framework appropriately with the zone, temp, crossed trip and event details. Signed-off-by: Yegnesh S Iyer Signed-off-by: Bin Gao Signed-off-by: Zhang Rui

thermal: generic-adc: Add ADC based thermal sensor driver

2016-05-17T14:28:31+00:00

In some of platform, thermal sensors like NCT thermistors are connected to the one of ADC channel. The temperature is read by reading the voltage across the sensor resistance via ADC. Lookup table for ADC read value to temperature is referred to get temperature. ADC is read via IIO framework. Add support for thermal sensor driver which read the voltage across sensor resistance from ADC through IIO framework. Acked-by: Jonathan Cameron Signed-off-by: Laxman Dewangan Signed-off-by: Eduardo Valentin

thermal: add temperature sensor support for tango SoC

2016-05-17T14:28:30+00:00

The Tango thermal driver provides support for the primitive temperature sensor embedded in Tango chips since the SMP8758. This sensor only generates a 1-bit signal to indicate whether the die temperature exceeds a programmable threshold. Signed-off-by: Marc Gonzalez Signed-off-by: Eduardo Valentin

thermal: tegra: move tegra thermal files into tegra directory

2016-05-17T14:28:27+00:00

Move Tegra soctherm driver to tegra directory, it's easy to maintain and add more new function support for Tegra platforms. This will also help to split soctherm driver into common parts and chip specific data related parts. Signed-off-by: Wei Ni Signed-off-by: Eduardo Valentin