kernel/git/stable/linux.git/drivers/thermal/Makefile, branch linux-4.2.y

Merge branches 'release' and 'thermal-soc' of .git into next

2015-06-11T04:52:14+00:00

thermal: hisilicon: add new hisilicon thermal sensor driver

2015-06-03T22:58:52+00:00

This patch adds the support for hisilicon thermal sensor, within hisilicon SoC. there will register sensors for thermal framework and use device tree to bind cooling device. Signed-off-by: Leo Yan Signed-off-by: kongxinwei Signed-off-by: Eduardo Valentin

thermal: introduce the Power Allocator governor

2015-05-05T04:27:52+00:00

The power allocator governor is a thermal governor that controls system and device power allocation to control temperature. Conceptually, the implementation divides the sustainable power of a thermal zone among all the heat sources in that zone. This governor relies on "power actors", entities that represent heat sources. They can report current and maximum power consumption and can set a given maximum power consumption, usually via a cooling device. The governor uses a Proportional Integral Derivative (PID) controller driven by the temperature of the thermal zone. The output of the controller is a power budget that is then allocated to each power actor that can have bearing on the temperature we are trying to control. It decides how much power to give each cooling device based on the performance they are requesting. The PID controller ensures that the total power budget does not exceed the control temperature. Cc: Zhang Rui Cc: Eduardo Valentin Signed-off-by: Punit Agrawal Signed-off-by: Javi Merino Signed-off-by: Eduardo Valentin

thermal: Add QPNP PMIC temperature alarm driver

2015-05-05T04:27:51+00:00

Add support for the temperature alarm peripheral found inside Qualcomm plug-and-play (QPNP) PMIC chips. The temperature alarm peripheral outputs a pulse on an interrupt line whenever the thermal over temperature stage value changes. Register a thermal sensor. The temperature reported by this thermal sensor device should reflect the actual PMIC die temperature if an ADC is present on the given PMIC. If no ADC is present, then the reported temperature should be estimated from the over temperature stage value. Cc: David Collins Signed-off-by: Ivan T. Ivanov Signed-off-by: Eduardo Valentin

thermal: intel Quark SoC X1000 DTS thermal driver

2015-05-01T03:20:43+00:00

In Intel Quark SoC X1000, there is one on-die digital temperature sensor(DTS). The DTS offers both hot & critical trip points. However, in current distribution of UEFI BIOS for Quark platform, only critical trip point is configured to be 105 degree Celsius (based on Quark SW ver1.0.1 and hot trip point is not used due to lack of IRQ. There is no active cooling device for Quark SoC, so Quark SoC thermal management logic expects Linux distro to orderly power-off when temperature of the DTS exceeds the configured critical trip point. Kernel param "polling_delay" in milliseconds is used to control the frequency the DTS temperature is read by thermal framework. It defaults to 2-second. To change it, use kernel boot param "intel_quark_dts_thermal.polling_delay=X". User interacts with Quark SoC DTS thermal driver through sysfs via: /sys/class/thermal/thermal_zone0/ For example: - to read DTS temperature $ cat temp - to read critical trip point $ cat trip_point_0_temp - to read trip point type $ cat trip_point_0_type - to emulate temperature raise to test orderly shutdown by Linux distro $ echo 105 > emul_temp Tested-by: Bryan O'Donoghue Signed-off-by: Ong Boon Leong Reviewed-by: Bryan O'Donoghue Reviewed-by: Kweh, Hock Leong Signed-off-by: Zhang Rui

Thermal: Intel SoC: DTS thermal IOSF core

2015-05-01T03:20:42+00:00

This is becoming a common feature for Intel SoCs to expose the additional digital temperature sensors (DTSs) using side band interface (IOSF). This change remove common IOSF DTS handler function from the existing driver intel_soc_dts_thermal.c and creates a stand alone module, which can be selected from the SoC specific drivers. In this way there is less code duplication. Signed-off-by: Srinivas Pandruvada

thermal: rockchip: add driver for thermal

2014-11-24T18:35:07+00:00

Thermal is TS-ADC Controller module supports user-defined mode and automatic mode. User-defined mode refers,TSADC all the control signals entirely by software writing to register for direct control. Automaic mode refers to the module automatically poll TSADC output, and the results were checked.If you find that the temperature High in a period of time,an interrupt is generated to the processor down-measures taken;If the temperature over a period of time High, the resulting TSHUT gave CRU module,let it reset the entire chip, or via GPIO give PMIC. Signed-off-by: zhaoyifeng Signed-off-by: Caesar Wang Reviewed-by: Dmitry Torokhov Signed-off-by: Eduardo Valentin

thermal: Add Tegra SOCTHERM thermal management driver

2014-11-20T14:43:17+00:00

This adds support for the Tegra SOCTHERM thermal sensing and management system found in the Tegra124 system-on-chip. This initial driver supports temperature polling for four thermal zones. Signed-off-by: Mikko Perttunen Signed-off-by: Eduardo Valentin

thermal: introduce clock cooling device

2014-11-20T14:43:16+00:00

This patch introduces a new thermal cooling device based on common clock framework. The original motivation to write this cooling device is to be able to cool down thermal zones using clocks that feed co-processors, such as GPUs, DSPs, Image Processing Co-processors, etc. But it is written in a way that it can be used on top of any clock. The implementation is pretty straight forward. The code creates a thermal cooling device based on a pair of a struct device and a clock name. The struct device is assumed to be usable by the OPP layer. The OPP layer is used as source of the list of possible frequencies. The (cpufreq) frequency table is then used as a map from frequencies to cooling states. Cooling states are indexes to the frequency table. The logic sits on top of common clock framework, specifically on clock pre notifications. Any PRE_RATE_CHANGE is hijacked, and the transition is only allowed when the new rate is within the thermal limit (cooling state -> freq). When a thermal cooling device state transition is requested, the clock is also checked to verify if the current clock rate is within the new thermal limit. Cc: Zhang Rui Cc: Mike Turquette Cc: Nishanth Menon Cc: Pavel Machek Cc: "Rafael J. Wysocki" Cc: Len Brown Cc: Greg Kroah-Hartman Cc: linux-pm@vger.kernel.org Cc: linux-arm-kernel@lists.infradead.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin Signed-off-by: Eduardo Valentin

Merge branch 'int340x-thermal' of .git into next

2014-10-17T06:30:58+00:00