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| author | Miquel Raynal <miquel.raynal@bootlin.com> | 2026-08-23 14:30:31 +0200 |
|---|---|---|
| committer | Miquel Raynal <miquel.raynal@bootlin.com> | 2026-08-23 14:30:31 +0200 |
| commit | 9b7e2fe0fe37f79e35467929d578c8c9f0f9cfdd (patch) | |
| tree | 891095842d3f57bcde733a21c77e7d1269ff4ee8 /scripts/stackusage | |
| parent | 94d32f1ace8ee3ef3537ac6c8e71b76a418a4762 (diff) | |
| parent | 15a3cbce32994141252bb4ecfe3ff3a5d22d0b4f (diff) | |
| download | linux-9b7e2fe0fe37f79e35467929d578c8c9f0f9cfdd.tar.gz linux-9b7e2fe0fe37f79e35467929d578c8c9f0f9cfdd.zip | |
Merge tag 'nand/for-7.3' into mtd/next
* Raw NAND changes
- Sunxi: Support added for the H616 compatible
- Qcom: Support added for the MDM9607 compatible
- Support for the Toshiba TC58NVG1S3H part
- GPMI: New debugfs entry to expose the chip geometry
- PL353: Timing updates and software ECC support have been fixed
* SPI NAND changes
- fmsh: Support added for FM25G{01,02}B chips
- HeYangTek: Support added for HYF1GQ4UDACAE
Aside from these main changes, there is the usual load of misc fixes and
hardening changes.
Diffstat (limited to 'scripts/stackusage')
0 files changed, 0 insertions, 0 deletions