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authorHaritha S K <haritha.k@oss.qualcomm.com>2026-06-19 15:50:59 +0530
committerDaniel Lezcano <daniel.lezcano@kernel.org>2026-08-07 17:18:37 +0200
commit83f98a48f22c36bdbae0f5e07e07b26be44816eb (patch)
treeea931e7657494b49da34b34306a16d0e555d7b3a /tools/perf/scripts/python
parentc3dce117333c0e2fbdb35228d4960442d2b1ef54 (diff)
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dt-bindings: thermal: qcom-tsens: Document the Maili Temperature Sensor
Document the Temperature Sensor (TSENS) on the Qualcomm Maili SoC. Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com> Signed-off-by: Haritha S K <haritha.k@oss.qualcomm.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org> Link: https://patch.msgid.link/20260619-b4-maili-upstream-3-v2-1-e54516c37022@oss.qualcomm.com
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